In response to the growing use of 3D sensing technologies in everyday life, such as in consumer electronics, cabin gesture/facial sensing, and automotive Advanced Driver Assistance Systems (ADAS); short-pulse lasers are increasingly used in long-distance sensing applications.

In addition to testing traditional wafers, the 58636 also supports the measurement of heterogeneous integration wafers, including VCSEL on System (VoS) and VCSEL on Driver (VoD). The 58636 features specialized electronic circuit design and digital control capabilities to meet the need for accurate and fast drive and measurement of various types of DUTs. Compared to microsecond-level pulses, nanosecond-level pulse driving significantly reduces driving time, and the range of data that can be obtained is limited. Therefore, precise driving and corresponding high-frequency metrology systems are essential to achieve short-term pulse driving.

The Chroma 58636 test system is designed to meet the diverse short pulse measurement needs of various DUTs. For wafer form DUTs, the 58636 has employed a patented circuit design to achieve nanosecond-level driving and measurement. For heterogeneous bonded wafers, the 58636 utilizes a digital control system to drive the DUT's digital control circuit to perform the DUT test.

To facilitate precise drive, short-pulse devices come in various shapes and sizes. The testing methods for VoS and VoD DUTs differ from those of traditional wafers. Chroma can support printed circuit boards (PCBs), copper-aluminum boards, and other types of DUTs. With a variety of DUT carriers, different types of DUTs can be placed in the same system during testing.

Reliability verification is an integral part of wafer quality control during the manufacturing process. The 58636 platform, in conjunction with Chroma's Laser Diode Burn-in and Reliability Test System, provides a shared carrier solution for dual-machine use, enabling wafer acceptance testing (WAT) and lot acceptance testing (LAT) capabilities. By utilizing diverse carriers on a platform, the 58636 offers enhanced testing flexibility.

The patented optical head design can perform a variety of measurements. Test results such as voltage, current, resistance, spectrum, optical power, and near-field optics analysis can be obtained with a single touchdown, saving valuable clean room space.

Other optional features, such as multiple die test and automatic loading/unloading systems, further reduce testing time and labor costs. Multiple dies can be measured sequentially within the optical field in a single touchdown, significantly reducing movement time caused by repeated repositioning of the stage. The automatic loading/unloading system supports continuous measurement of 10-15 wafers, minimizing downtime caused by manual operations.