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As the technology of optoelectronic components is maturing, its applications are broadening as well. Take laser diodes for example, they are no longer limited to communication applications but have expanded into consumer products. Photonics test solutions mainly focus on testing optoelectronic components, such as photodiode, LED, EEL, and VCSEL. They can also apply to configurations from upstream to downstream processes, including wafer, laser bar, bare chip, CoS, and TO-CAN. Chroma's system integration technology uniquely combines automation equipment with precision current sources, temperature controllers, and automated optical measurement instruments to perform an array of electrical, optical power, wavelength, near-field and far-field optics, and other optoelectronic characteristic and aging tests.
Chroma offers precision instruments such as laser drivers, photodetector monitoring, and temperature controllers. These lab class instruments are often integrated into production solutions for wafer probe test, burn-in and device or module characterization then reinforced with inspection, metrology, robotics, Industry 4.0 and more.
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Wafer Level Test
In-process Wafer Inspection System
Model 7945
- Double side inspection (post-diced wafer)
- Full color defect detection
- Fast multi-computer image processing
- Shared auto wafer loader
Short Pulse Photonics Device Probing Test System
Model 58636 Series
- Nanosecond-scale pulse driving and measurement
- Drive heterogeneous integration samples like VoS (VCSEL on Silicon), and VoD (VCSEL on Driver) with digital control
- Patented two-in-one optical head design fetches all LIV (Light-Current-Voltage), wavelength, and near-field optics analysis data in one touchdown
- Multi-site and multi-die support enhance test efficiency
Photonics Wafer Probing Test System
Model 58635 Series
- Up to 6" wafer
- Support both QCW and CW operation
- LIV test, Near Field test, Far Field test, LIV-λ & NF two-in-one test
Wafer Chip Inspection System
Model 7940
- Simultaneous double side color inspection
- 6" wafer/8" inspection area
- Automatic wafer alignment
- Wafer shape/edge identification
Package Level Test
Photonics Module Test System
Model 58625
- All-in-one test system
- Flexible test station arrangement
- Precise temperature control -20~85℃
- Large beam angle measurement
High Channel Density Burn-in Tester
Model 58604-C
- Use with chamber or oven for burn-in, reliability and life test
- Auto Current Control (ACC), and Auto Voltage Control (AVC) modes
- Modular design for easy customization and maintenance
- Comprehensive ESD protection
- Independent channels for source and measurement
Laser Diode Burn-in and Reliability Test System
Model 58604
- Applicable for burn-in, reliability and life testing
- ACC and APC burn-in modes
- Individual channel driving and measurement. Up to 500mA per channel or parallel up
- Precise temperature control up to 125°C
- Independent module operation
High Power Laser Diode Burn-In and Reliability Test System
Model 58605
- Burn-in, reliability and life test
- ACC and APC control modes
- Independent channel for source and measurement
- Spike-Free sourcing
- Up to 6000 mA per channel and pulsing
Photodiode Burn-in and Reliability Test System
Model 58606
- Burn-in, reliability and life test
- Dark Current and Breakdown Voltage
- 256 channels Bi-polar device source per drawer
- High bias source to 80 volts
Laser Diode Characterization System
Model 58620
- Full turnkey automated test for edge-emitting laser diodes
- High precision and large capacity carrier, interchangeable with other automated equipment
- Fully automated alignment for fiber-coupled tests
Laser Diode Reliability, Burn-In and Life-Test System
Model 58602
- Burn-In, Reliability and Life Testing
- Up to 4608 Channels
- Up to 20A per device
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