Behind Every Semiconductor Breakthrough
Chroma ATE Inc. is excited to announce its participation in SEMICON Taiwan 2024. At this year's event, Chroma will showcase a range of breakthrough semiconductor testing solutions tailored for AI, High-Performance Computing (HPC), automotive, and AIoT applications, designed to meet the rapidly evolving demands of the industry.
Advanced SoC and RF Test Solutions
In AI chip testing,'scan' and 'built-in self test'(BIST) technologies are fast becoming the go-to alternatives to traditional high-speed digital testing methods. Addressing this trend, the Chroma 3680 high-precision SoC testing system is specifically designed for Edge AI and IoT communication chips, capable of meeting high-speed and high-precision mixed-signal testing needs. This system features up to 2,048 digital I/O pins with data rates up to 1Gbps, supports up to 16G scan vector storage depth, and provides various test modules for digital logic, parametric test units, power, memory, and mixed-signal testing.
Complementing the 3680 system, Chroma's HDRF2 function board delivers high-quality RF signal test utilizing a Direct Mount test architecture. The board supports various communication technologies such as Bluetooth, Wi-Fi, and NB-IoT, and can be paired with an up/down converter to reach the 30 GHz millimeter-wave band, fulfilling ultra-wideband (UWB) testing requirements.
Tri-Temp Test System
Engineered to tackle the heat dissipation challenges posed by the AI era, the Chroma 31000R-L Tri-Temp test system is designed for rigorous temperature testing. Offering a stable temperature control range of -40°C to +150°C with a heat dissipation capacity of up to 2,700W, the 31000R-L is an ideal choice for advanced and high-end IC tri-temp testing.
The system is compatible with automated handlers like Chroma models 3210/3110/3260/3200, enabling IC testing from development to production. It meets testing needs for advanced packaging ICs in AI, cloud, automotive, IoT, HPC, and data center applications, an optimal solution for customers looking to foray into the AI domain and align with global testing standards for advanced packaging ICs.
Advanced Packaging 3D Metrology Solutions
The Chroma 7980/7981 employs Chroma's patented integrated measurement technology BLiSTM, specifically designed for precision measurement of nanoscale critical dimensions. The 7980/7981 offers algorithms and a user interface developed for high-speed measurement and rapid-focus surface profile analysis, including large-area stitching capabilities, to meet the needs of advanced packaging processes such as TSV/VIA, RDL, Probe Mark, Overlay, and sub-um Surface Profile. Chroma's 7961 model offers proprietary contactless optical inspection equipment and in-situ AOI, assisting customers in detecting defects during the manufacturing process and enabling real-time quality analysis and control.
Nano-Level Chemical Solution Particle Monitoring System - SuperSizer Series
The SuperSizer Nano Particle Monitoring System employs advanced aerosol measurement technology to overcome bubble interference, enabling precise monitoring of particles ranging from 3 nm to 20 nm. The SuperSizer family currently includes generations II, V, VI, and VII, each suitable for monitoring slurry, isopropyl alcohol, hydrogen peroxide/pure water, and ammonia water. Through real-time monitoring, the system effectively minimizes wafer damage and improves the quality of chemical solutions. To learn more, please feel welcome to talk to our team and take a look at our product brochures at booth K2676.
At SEMICON Taiwan 2024 (September 4-6), Chroma will showcase a diverse array of test solutions at Taipei Nangang Exhibition Center, Hall 1, 1F, Booth K2676. We will also participate in the Semiconductor Advanced Inspection and Metrology Forum to discuss the impact of metrology and inspection on semiconductor sustainability. We cordially invite you to join us at this landmark industry event and speak with our experts about the latest developments in semiconductor test and measurement.