Chroma ATE
Revolutionizing Semiconductor Metrology
Chroma's Cutting-Edge 2D/3D Solutions

In the highly dynamic world of semiconductors, the escalating complexity of chip design and the relentless climb in technical challenges pose formidable risks: diminished yield rates and higher packaging expenses. To combat these unforeseen costs, the criticality of process control cannot be overstated. Rising risk levels are causing foundries to shift from offline wafer measurement to in-line quality control. Enter the world of nanoscale with us – where challenges drive innovation and excellence.
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Chroma 7980

Advanced Metrology with Chroma 7980/7981


Semiconductor packaging technology is evolving at a breakneck pace. Advanced packaging is producing ever more powerful computation while reducing power consumption. We've embraced the integration of the chiplet, HBM, SoC, and 2.5D/3D packaging. Chroma's advanced R&D and engineering capabilities ensure our comprehensive optical solutions cover the entire processes of advanced packaging.

Chroma 7980
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Patented BLiSTM Technology
Chroma 7980/7981 adopts novel in-house developed BLiS technology and a specially designed platform to achieve 2D and 3D nanoscale nondestructive measurement. BLiS integrates multiple optical probes in one module for different advanced packaging applications.
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Large Area Pictures Stitching
The large-area stitching capability can meet various industry needs.
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Fast Autofocus and Measurement
A specially designed scanning system and innovative algorithms, deliver increased WPH.
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Quality Control Monitor
The built-in QCM can self-test and monitor the system's health.
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Applications for Advanced Packaging
Probe Mark Indentation, Critical Dimension Measurement for TSV/VIA and RDL, Overlay Measurement, Sub-µm 2D/3D Surface Topography, etc.

Chroma 7980/7981 features our patented BLiSTM technology and a system quality monitor, delivering accurate 2D and 3D critical dimension and profile measurements for 6 to 12-inch wafers. Our software is purpose-built for various advanced packaging applications, catering seamlessly to your unique data, reporting, and workflow needs. Say goodbye to wasted time and resources on pre-processing with our innovative approach.

Interested in experiencing the future of semiconductor metrology with Chroma? Click 2D/3D Wafer Metrology System Model 7980 to discuss leading-edge solutions and support for your metrology needs from prototyping to scaling.

Contact us for more information

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